LS400 SUPERNOVA Entech HVLP
- HVLP Technology – 10 PSI at the nozzle
- Concentrated coarse atomization
- Excellent for solvent or waterborne basecoat application
- Large fan pattern
- Superior transfer efficiency
FEATURES
- Patented LV Technology with split nozzle for increased material savings
- HVLP Technology - with low operating air pressure
- Excellent for solvent or waterborne base coat and clear coat application
- Large fan pattern
- Superior transfer efficiency
- Quality surface for easy cleaning
- Compatible with the 3M PPS cup system (adapter #43)
